The next Bluetooth® release is expected to be ratified soon. One important new feature is the Unified Test Protocol (UTP) Test Mode for Bluetooth® Low Energy, that will complement existing test methods.
- New DSPs offer scalable architecture and dual thread design with support for AI, addressing growing demand for smarter, more efficient wireless infrastructure - High-performance Ceva-XC23 DSP delivers 2.4X improvements in performance and area efficiency for more intensive applications - Ceva-XC21 targets cost-sensitive applications delivering up to 1.8X performance and efficiency improvements and requiring up to 48% less area ROCKVILLE, Md. , Feb. 27, 2025 /PRNewswire/ -- Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP that enables Smart Edge devices to connect, sense and infer data more reliably and efficiently, today launched its latest high-performance, baseband vector DSPs targeting advanced 5G and 6G-ready applications.
CEVA, Inc. (NASDAQ:CEVA ) Q4 2024 Earnings Conference Call February 13, 2025 8:30 AM ET Company Participants Richard Kingston – Vice President-Market Intelligence and Investor and Public Relations Amir Panush – Chief Executive Officer Yaniv Arieli – Chief Financial Officer Conference Call Participants Kevin Cassidy – Rosenblatt Securities Suji Desilva – Roth Capital Gus Richard – Northland Chris Reimer – Barclays Operator Good day, and welcome to the CEVA Fourth Quarter and Year End 2024 Earnings Conference Call. All participants will be in listen-only mode.
Signal processing specialist Ceva (CEVA 1.18%) reported fourth-quarter results on Thursday, Feb. 13, that matched or exceeded analysts' consensus expectations. Total revenue of $29.2 million outperformed analysts' forecasts of $27 million while adjusted earnings per share (EPS) stood at $0.11, in line with forecasts and showing a 10% year-over-year increase.
WQ9201 2x2 MIMO Wi-Fi 6+BT combo chip targets consumer electronics products featuring fast data transmission, such as smartphones, tablets, PCs, TVs, and set-top-boxes ROCKVILLE, Md. , Feb. 5, 2025 /PRNewswire/ -- Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP that enables Smart Edge devices to connect, sense and infer data more reliably and efficiently, today announced that WUQI Microelectronics, a leading semiconductor fabless company focus on connectivity and edge AI chips, has licensed and deployed the Ceva-Waves Wi-Fi 6 High-Performance STA IP platform in its WQ9201 Wi-Fi/Bluetooth combo chip targeting smartphones, tablets, PCs, TVs, and set-top-boxes.
ROCKVILLE, Md. , Jan. 29, 2025 /PRNewswire/ -- Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP that enables Smart Edge devices to connect, sense and infer data more reliably and efficiently, today announced the appointment of Amir Faintuch, a seasoned technology executive, to its Board of Directors as an independent director.
Lonquan 560 SoCs leverage Ceva-SensPro Vision AI DSP to advance ADAS capabilities amidst China's rapidly growing EV market and global shift towards more sustainable and intelligent transportation solutions LAS VEGAS , Jan. 8, 2025 /PRNewswire/ -- CES 2025 -- Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP that enables Smart Edge devices to connect, sense and infer data more reliably and efficiently, today announced that Oritek Semiconductor, a provider of AI system-on-chip (SoC) solutions for intelligent automotive platforms, has licensed Ceva's SensPro™ Vision AI DSP for its Longquan 560 series of Advanced Driver Assistance Systems (ADAS) chipsets. The Longquan 560 series represents Oritek's commitment to innovation, catering to diverse intelligent automotive needs of Electric Vehicles (EV) such as AI-based headlights, camera monitoring systems (CMS), zone control units (ZCU), and integrated central computing units for driving and parking.
- Cyberon and AIZIP collaborate with Ceva to offer pre-optimized AI models for Ceva-NeuPro-Nano Embedded AI NPUs including keyword spotting, face recognition and speaker identification - Expanded collaboration with Edge Impulse includes support for NVIDIA's TAO Toolkit and availability of Edge Impulse Studio integration with Ceva-NeuPro-Nano LAS VEGAS , Jan. 7, 2025 /PRNewswire/ -- CES 2025 -- Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP that enables Smart Edge devices to connect, sense and infer data more reliably and efficiently, today announced new partnerships that enable the more efficient development of AI-enabled personalization, convenience and security features in devices. The partnerships expand the embedded AI ecosystem for the Ceva-NeuPro-Nano NPU and include new collaborations with Cyberon Corporation and AIZIP that are designed to streamline development time by offering pre-optimized neural networks for keyword spotting, face recognition and speaker identification for deployment on smart edge devices.
-Companies partner to bring Ceva-RealSpace Elevate multi-channel spatial audio solution with head tracking to the MediaTek Dimensity 9400 flagship 5G smartphone chip, delivering immersive audio experiences to True Wireless Stereo (TWS) earbuds and headphones using Bluetooth® LE Audio -At CES 2025, Ceva will demonstrate the groundbreaking spatial audio solution, creating a true-to-life listening experience beyond traditional stereo and surround sound systems LAS VEGAS , Jan. 6, 2025 /PRNewswire/ -- Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP that enables Smart Edge devices to connect, sense and infer data more reliably and efficiently, and MediaTek, a global leader in semiconductors today announced a partnership to enhance the mobile entertainment experience, bringing the Ceva-RealSpace Elevate multi-channel spatial audio with head tracking solution to the recently introduced MediaTek Dimensity 9400 flagship 5G smartphone chip using Bluetooth® LE Audio. Ceva-RealSpace Elevate is Ceva's premium spatial audio software offering for Android and Windows devices, providing an immersive spatial audio experience for multi-channel and ambisonics content.
- Extending its Smart Edge IP leadership, Ceva-NeuPro-Nano™ received the Best IP/Processor of the year - Ceva-NeuPro-Nano NPUs deliver optimal balance of ultra-low power and best performance in small area to efficiently execute embedded AI workloads in consumer, industrial and general-purpose AIoT products ROCKVILLE, Md. , Dec. 5, 2024 /PRNewswire/ -- Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP that enables Smart Edge devices to connect, sense and infer data more reliably and efficiently, announced today that the Ceva-NeuPro-Nano NPUs have been awarded the Best IP/ Processor of the Year award at the prestigious EE Awards Asia event, recently hosted in Taipei.