ANSYSNASDAQ: ANSS

Supported by the CHIPS Act, Microelectronics Commons will use Ansys digital engineering technology to enhance the production of semiconductors in the U.S. The network includes eight regional technology hubs aimed at promoting innovation in areas like 5G/6G, AI, and quantum technologies. Ansys will assist six of these hubs through its Cross Hub Enablement Solution program, providing access to a wide range of simulation tools to foster advancements in microelectronics.

Vertiv improves its design methods and speeds up innovation by using Ansys' Minerva and optiSLang simulation tools.

ANSS' revenue for the third quarter is boosted by significant growth in long-term leases. The company anticipates that its annual contract value (ACV) will increase by double digits in 2024.

Ansys (ANSS) reported quarterly earnings of $2.58 per share, which is higher than the Zacks Consensus Estimate of $1.88 per share. This is an increase compared to earnings of $1.41 per share from the same period last year.

On Wednesday, Ansys exceeded Wall Street's predictions for its revenue and profit in the third quarter, thanks to an increase in demand for its AI-driven tools and engineering software.

PITTSBURGH, Oct. 17, 2024 /PRNewswire/ -- ANSYS, Inc. (NASDAQ: ANSS) shared today that it plans to announce its third quarter earnings on Wednesday, November 6, 2024, after the market ends. The company has also stated that due to its ongoing deal with Synopsys, Inc., it will not hold quarterly earnings calls or offer guidance for quarterly or annual results.

Faraday Technology will use ANSS's advanced simulation tools to create improved designs for 2.5D and 3D integrated circuits.

Ansys' certified semiconductor solutions will help Faraday reduce the time needed for designing 2.5D/3D integrated circuits (ICs) while ensuring that the designs achieve their performance and signal integrity targets. Faraday Technology Corporation plans to use Ansys RaptorX™ for on-chip electromagnetic modeling to improve its advanced packaging designs. This collaboration will allow Faraday to enhance its interposer and multi-die designs, leading to better memory bandwidth and overall performance for applications in AI, IoT, and 5G.

ANSS is enhancing its collaboration with TSMC to promote advancements in 3D-IC design and multiphysics solutions by utilizing AI technology. This partnership aims to foster innovation in these areas.